Items

Process capability

Layers

1-36L

Board thickness

0.1-8.0mm

High Frequency

PTFE，Ceramic，Rogers

HDI

HDI

HDI Stage

1-5 Stage（≥6 Stage need to appraisal）

Mini PCB Size(Dimension)

5*5mm（less than 3mm need to appraisal）

Maximum PCB Size(Dimension)

500*1100mm

Max Finish copper thickness

12OZ

Min Finish copper thickness

1/2oz

Layer to layer accuracy

≤3mil

Board thickness of Resin

0.2-6.0mm

Board thickness tolerance

Thickness≤1.0mm；±0.1mm

Thickness＞1.0mm；±10%

Impedance tolerance

±5Ω（＜50Ω），±10%（≥50Ω）；Min±8%（≥50Ω）

Bow and twist

Normal:0.75%，Min:0.5%   Max:2.0%

Lamination times

one core ≤5 times

Project name

Process capability

Normal TG FR4

SY S1141，KB 6160A

Middle TG FR4

SY S1150G，KB6165 F，KB6165G(HF)

High TG FR4

SY S1000-2，SY S1165(HF)，KB 6167G(HF)，KB 6167F，TU-768，TU-872，VT-47；

Aluminum

GL12，SPS-AL-01，CH-AL-LM3

CTI 600

SY S1600

High Frequency

Rogers4350，Rogers4003;Arlon 25FR，25N;

PTFE

Rogers series，Taconic series，Arlon series，F4Bseries ，TP series

Minture+FR4

Project name

Process capability

Layers

Alu. 1-4, Metal 1-8L, Ceramic board 1-2L

Size

MAX: 610*610mm, MIN: 5*5mm

Max Panel size(Ceramic board)

100*100mm

Finish board thickness

0.5-5.0mm

Copper thickness

0.5-12 OZ

Metal thickness

0.5-4.5mm

Metal material type

AL:1100/1060/2124/3003/5052/6061;Copper:Purple copper

Min finish holes and tolerance

NPTH:0.5±0.05mm；PTH(Aluminum;Metal)：0.3±0.1mm；

CNC tolerance

±0.2mm

PCB Surface Treatment

HASL/HASL L/F;OSP；ENEPIG；Hard gold;Heavy gold

Metal PCB Surface Treatment

ENEPIG

Metal material

Bergquist（MP06503，HT04503）；TACONIC（TLY-5，TLY-5F）；

Dielectric thickness

75-200um

Thermal conductivity

0.3-3W/m.k（Aluminum,Metal）；24-180W/m.k（Ceramic）

Project name

Process capability

Rigid board

Back board, HDI, Multi-layer buried board, Heavy copper, Power heavy copper, IC Substrate etc..

Project name

Process capability

HDI board

1+N+1, 1+1+N+1+1, 2+N+2, 3+N+3(Buried hole size 0.3mm),

Filled vias with copper capped

Project name

Process capability

PB Free

Gold Plating ，ENIG，Gold finger，HASL L/F，OSP，ENEPIG，immersion silver，immersion Tin，ENIG+OSP，ENIG+G/F，Gold Plating +G/F，immersion silver+G/F，immersion Tin+G/F

PB

HASL

A/R Ratio

10：1（HASL，HASL L/F，ENEPIG，immersion silver，immersion Tin）；8：1（OSP）

Board thickness

ENIG：0.2-7.0mm，immersion Tin：0.3-7.0mm（Vertical），0.3-3.0mm（Level）；immersion silver：0.3-3.0mm；HASL，HASL L/F：0.6-3.5mm，OSP：0.3-3.0mm；Gold plating：0.3-5.0mm（A/R:10:1）

IC SPACE

3mil

Project name

Process capability

HASL，HASL L/F

2-40um（HASL MAX:0.4um，HASL L/F MAX:1.5um）

OSP

0.2-0.4um

ENIG

Ni：3-5um；Au：1-5uinch，≥3uinch(Need to appraisal)

Immersion silver

6-12uinch

Immersion Tin

≥1um

Gold Hard Plating

2-50uinch

ENEPIG

Ni:3-5um，Pd：1-6uinch，Au：1-5uinch

Gold Plating

Au:0.025-0.10um，Ni≥3um，

Gold Plating +G/F

Au:1-50uinch，Ni≥3um

Carbon ink

10-50μm

Liquid

copper(10-18um)，via hole（5-8um），line corner≥5u

Peelable

0.20-0.80mm

Project name

Process capability

0.15/0.2mm Mechanical drilling board thickness(Max)

1.5mm/2.5mm

Laser drilling size(Min)

0.1mm

Laser drilling size(Max)

0.15mm

Drilling size

0.15-6.2mm

PTFE series :0.25mm(drill bit:0.35mm）

Mechanical Blind and Burried holes size≤0.3mm

Close hole size:0.35mm(Min)（drill bit:0.45mm）

PTH Half hole size:0.40mm（drill bit:0.5mm

A/R Ratio

20:1(≤0.2mm)

Back drill depth

0.2mm

Drilling to conductor space

5.5mil(≤8L)；6.5mil（10-14L）；7mil(＞14L)

Mechanical drilling to conductor space(2stage HDI)

7mil（one time）；8mil(two time)；9mil(three time)

Laser drilling to conductor space

7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2）

PTH edge to PTH edge space(diff net)

10mil

PTH edge to PTH edge space(same net)

6mil(drilling;laser drilling)；10mil（Mechanical HDI）

NPTH edge to NPTH edge space

8mil

Drilling accuracy

±2mil

NPTH tolerance

±2mil

PTH tolerance

±2mil

countersunk

±0.15mm

Project name

Process capability

Inner Layer and outer Layer PAD size(Laser drilling)

10mil（4mil Laser drilling size），11mil（5mil Laser drilling size）

Inner Layer and outer Layer PAD size(Mechanical drilling)

16mil（8mil drilling size）

BGA PAD Size(min)

HASL:10mil，Other:7mil

BGA tolerance

+/-1.2mil（PAD＜12mil）；+/-10%（PAD≥12mil）

Project name

Process capability

width/space

1/2OZ：3/3mil

1OZ: 3/3.5mil

2OZ: 5/5mil

3OZ: 7/7mil

4OZ: 10/10mil

5OZ: 15/15mil

6OZ: 18/18mil

7OZ: 20/20mil

8OZ: 24/24mil

9OZ: 26/26mil

10OZ: 28/28mil

12OZ: 32/32mil

Line tolerance

≤10mil：+/-1.0mil

＞10mil：+/-1.5mil

Project name

Process capability

Solder mask plugged hole size(Min)

0.5mm

Solder mask color

Green，Yellow，Black，Blue，Red，White，Purple，Pink，Matt Green，Matte Black，cold white.

Silk screen color

White，Yellow，Black

Peelable hole size(Max)

10.0mm

Resin hole size

0.1-1.0mm

Solder mask dam

Green:3.5mil，Other:6mil

Silk screen line width(Min)

Width:3mil,High:24mil(White)； Width:5mil,High:32mil(Black)；

Hollow out on silk screen space(Min)

Width:8mil,High:40mil

Hollow out on solder mask space(Min)

Width:8mil,High:40mil

Project name

Process capability

V-CUT to conductor space

H≤1.0mm:0.3mm(20°)，0.33mm(30°)，0.37mm(45°);

1.0＜H≤1.6mm:0.36mm(20°)，0.4mm(30°)，0.5mm(45°);

1.6＜H≤2.4mm:0.42mm(20°)，0.51mm(30°)，0.64mm(45°);

2.4＜H≤3.2mm:0.47mm(20°)，0.59mm(30°)，0.77mm(45°);

V-CUT symmetrical tolerance

±4mil

V-CUT Angle tolerance

±5°

V-CUT Spec

20°，30°，45°

G/F bevel

20°，30°，45°

G/F bevel angle tolerance

±5°

Controlled milling/drill tolerance(NPTH)

±0.10mm

Outline tolerance

±4mil

Router slot hole tolerance（PTH）

Slot hole width and length ±0.15mm

Router slot hole tolerance（NPTH）

Slot hole width and length ±0.10mm

Drilling slot hole tolerance（PTH）

±4mil

Drilling slot hole tolerance（NPTH）

±2mil