Pcba Proccess Capability

SMT process

Standard Capability

Limited Capability

Remark

PCB

Min Size

L≥30mm,W≥30mm

L<30mm,W<30mm

BOT、TOP sides components、Fiducial Mark should be≥3mm from the board edge.

Max Size

L≤650mm,W≤400mm

L:800-650mm,W:400-450mm

Component thickness(T)

0.5mm≤T≤3mm

T<0.5mm T>3mm

Component size

Min Package

0201

(0.6mm*0.3mm)

01005

(0.3mm*0.2mm)

QFP、QFN、SOP、SOJ

Min Pin distance

0.4mm

0.3mm≤Pitch<0.4mm

CSP、BGA

Min Pitch distance

0.4mm

0.3mm≤Pitch<0.4mm

DIP Process (Wave soldering)

Standard Capability

Limited Capability

Remark

PCB size

Min Size

L≥30mm,W≥30mm

 L<30mm

Max Size

L≤650mm,W≤400mm

L:800-650mm,W:400-450mm

Thinnest size

0.4mm

T<0.4mm

Thickest size

5mm

T>5mm

Conformal Coating Process

Standard Capability

Limited Capability

Remark

Technological 

Temperature range

-30°C≤T≤120°C

-50°C≤T≤150°C

parameter

Coating thickness

20um≤T≤35um

35um≤T≤60um

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